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AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.

To enhance our successful R&D Team in Leoben, Austria, we are looking for a passionate

Senior Expert R&D – Substrate & Packaging Industrialization

In your role, you will be responsible for the evaluation and transfer of integration approaches for components requiring high-precision alignment within substrate and packaging environments. The role focuses on assessing feasibility under realistic production conditions and contributes to the development and realization of integration approaches. The position contributes to building and validating integration processes through hands-on experimental work and process development, ensuring that concepts can be translated into stable and scalable solutions.

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Ready for a new challenge to advance your career? It´s just a click to apply online. We look forward to your application and your detailed resume. Your AT&S Team!

AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry, employment group H, and we offer competitive salaries and additional benefits based on your performance, experience and qualification. 

Senior Expert - Substrate & Packaging Industrialization

Senior Expert - Substrate & Packaging Industrialization

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